COPPER CMP*

*Barrier materials: Ta, TaN, TiN; Electroplate thickness ranges: 7KA-15KA Cu

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
854/455Damascene CMP test mask contains serpentine structures of varying CD, density/pitch. Structures are electrically testable for quantitative measurement of dishing/erosion impact, have large arrays for profilometry/AFM, & are easily cleaveable for FIB/SEM imaging. Feature size range: 180nm up to 100um Design also contains a module with various dielectric slotting in large 100um metal lines for testing dishing vs. metal area.200 mm 300 mm180 nm5KA· PETEOS · SiN · Silox · Coral · Black Diamond
454854 design with added tiling, SRAM cells, logic cells, variable linewidth serpentines, metrology boxes, VHORGs, RVB/BTS structures for voltage or thermal breakdown, & others, extended down to 100nm feature size200 mm 300 mm100 nm﹤3KA· PETEOS · SiN · Silox · Coral · Black Diamond

STI FILL CMP

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
864 / 464STI CMP mask, including vertical & horizontal trenches at varying density200 mm & 300mm500nm5KA· polySi · thermal oxide · SiN · TEOS or HDP oxide fill
474STI CMP mask containing pattern rec features, various trench densities at vertical & horizontal orientation, posts/holes, litho/etch monitor module, & iso/dense trench module Feature sizes from 250nm up to 250um200 mm 300 mm250 nm3KA· PETEOS · SiN · Silox · Coral · Black Diamond
484STI CMP mask designed with input from CMP & material suppliers Includes enhanced metrology structures, various trench densities at vertical and horizontal orientation, isolated trench module, post/hole module, & SRAM test module Feature sizes from 130nm up to 500um200 mm 300 mm130 nm2KA· PETEOS · SiN · Silox · Coral · Black Diamond

ELECTRICAL TEST VEHICLES

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
461Capacitance-voltage (CV dot) maskset Electrically testable, 2-layer set; includes clearfield and darkfield masks Dots 11um up to 3.5mm200 mm & 300mmarge capacitors﹤4KArequest
400Cu damascene design similar to 800 maskset, extended down to 130nm200mm, 300mm130nm interconnect﹤4KA· PETEOS · SiN · Silox · Coral · Black Diamond
465Cu damascene design similar to 800 maskset, extended down to 90nm200mm, 300mm90nm interconnect﹤3KA· PETEOS · SiN · Silox · Coral · Black Diamond

METROLOGY

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
AMAG4LMetrology pattern containing the following features: cleavable line/space from 50 to 1000nm, cleavable contacts from 150 to 1000nm, scatterometry structures, electrical LW structures, alignment targets and LER structures.200 mm & 300mm80nm L/S, 60nm isoLrequestrequest
AMAG5LMetrology pattern containing the following features: cleavable line/space from 30 to 250nm, cleavable contacts from 80 to 250nm, dummy fill patterns, line end shortening structures, alignment targets, scatterometry structures, phase imbalance structures and LER structures.200mm, 300mm70nm L/S, 45nm isoLrequestrequest
OMAG4Designed to characterize optical overlay measurements and for use in the development of new optical overlay techniques.200 mm 300 mm100nm L/Srequestrequest

TSV ETCH/FILL

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
TSV193 TSV reticle field. Circular contact holes varying in diameter from 1 to 100um. Spacing includes 1:1, 1:2, 1:5 and ISO – both staggered and linear. Also includes structures with fixed spacing of 1um and 10um.200 mm1umSi
1XTSV1X TSV mask. Circular contact holes varying in diameter from 1 to 100um. Spacing includes 1:1, 1:2, 1:5 and ISO – both staggered and linear. Also includes structures with fixed spacing of 1um and 10um. Note: Vias smaller than 5um are considered subnominal on this mask.200 mm6umSi

CALIBRATION

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
Defect CalibrationSkorpios manufactures custom defect tool calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.200 mm & 300 mmrequestrequestrequest
Stage Movement CalibrationSkorpios manufactures custom stage calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.200 mm & 300 mmrequestrequestrequest
Optical Contrast CalibrationSkorpios manufactures custom stage calibration wafers for many major equipment suppliers. Contact us for help in designing for your needs.200 mm & 300 mmrequestrequestrequest

GENERAL PURPOSE

MASK SET PRODUCT DESCRIPTION WAFER SIZE MINIMUM FEATURE SIZE TYPICAL ETCH DEPTH TYPICAL FILMS AVAILABLE
QCDCleavable line/space features from 100 to 2000nm with variable pitch. Electrically testable features are included.200 mm & 300 mm100nmrequestrequest
QCECleavable contact features from 140 to 600nm with variable pitch.200 mm & 300 mm160nmrequestrequest
401Cleavable metrology pattern from 70nm to 500nm. Contains nine line/trench structures, nine electrically testable line width structures, six scatterometry structures, and eight VHorgs.200 mm & 300 mm90nmrequestrequest
MEMS-RES1X resolution mask contains lines, spaces, vias and posts with variable pitch. Also includes fluidics structures and other representative MEMs patterns200 mm5umrequestrequest

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