Novati to Showcase Positive Results of Hybrid Bonding at IEEE International Interconnect Technology Conference

May 16, 2017 07:00 AM Eastern Daylight Time Austin, TX – Novati Technologies, LLC, a semiconductor development and commercialization company, will present their poster, “Reliability of Hybrid Bond Interconnects,” at the 2017 IEEE International Interconnect Technology Conference in Hsinchu, Taiwan on May 16-18. 3D integration dramatically improves device performance, and hybrid bonding is gaining traction […]

Novati Technologies Focuses on Diverse Applications

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in […]

Orbotech’s SPTS Technologies Collaborates with Novati Technologies to Establish New Plasma Dicing Line

SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced its collaboration with Novati Technologies, a leading global nanotechnology development center, to establish Novati’s new plasma dicing line at their state-of-the-art fab in Austin, Texas. Novati has selected SPTS’s Rapier-300S plasma dicing solution over […]

Novati Technologies Focuses on Diverse Applications

Nanochip Vol11/Issue2/2016 Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texasbased Novati Technologies, a relatively small company with outsized importance in the 3D development field. Read more.

3D Memory Chips May Beat 3D Hybrid Memory Cube

A novel three-dimensional (3D) memory from the self-described “nanotechnology development center” with its own fab to boot will make an appearance next week at SEMICON Europa 2015. Novati Technologies Inc. (Austin, Texas)—a wholly owned subsidiary of Tezzaron Semiconductor—will show its latest foray into 3D chips that combine memory, logic, microelectromechanical systems (MEMS) and other sensors/actuators […]

Novati Technologies Selects Applied Materials to Create Advanced 200mm Line

Since the company’s inception in 2012, Novati Technologies has achieved tremendous growth, establishing itself as the go-to fab provider for “More than Moore” applications – including 3D and heterogeneous architectures, as well as advanced materials to enable new sensor and circuit functionality. Read the full press release here.